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Bei ya chini kupitia Kiwanda-Moja kwa moja
Fanya kazi na kiwanda cha umeme moja kwa moja ili kukata mtu wa kati. Mpya asili na bei ya chini na punguzo
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Kuegemea kwa Usalama na Ubora
Mfumo wa bima ya ubora kwa ubora wa juu wa bidhaa. Kwa Wakati, Kila Wakati utoaji wa Vipengele vya Ubora.
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Zaidi ya Milioni 15 ya Malipo
Zaidi ya 100+ watengenezaji maarufu duniani, zaidi ya orodha milioni 15. Hisa zinapatikana kwa usaidizi wa kununua moja kwa moja kwa bei ya punguzo.
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Huduma Rafiki kwa Wateja
Suluhisho moja la kusimama lililobinafsishwa kwa mahitaji yako ya kipekee. Usaidizi katika tovuti ya Lugha 12, urahisi zaidi na huduma za haraka.
- Rudi Nyumbani
- Watengenezaji Wote
- Henkel / Bergquist
Henkel / Bergquist
Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).
Henkel’s acquisition of The Bergquist Company in 2014 effectively expanded Henkel’s leading position in electronic materials development to include state-of-the-art thermal control products. Now covering nearly all phases of semiconductor packaging, electronics assembly, thermal management and structural assembly, Henkel is unmatched in its ability to provide top electronics companies with comprehensive material solutions.